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Die Brush & Foam Pad For Wafer Thin Dies - Sizzix
Die Brush & Foam Pad For Wafer Thin Dies - Sizzix

Die Brush & Foam Pad For Wafer Thin Dies

Sizzix - Accessories
item #: 922357-09798

Price $11.99

  

Worth 132 points

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

Product Dimensions: Die Brush: 5 1/2" x 1 3/4" x 1/4". Foam Pad: 4 1/2" x 7 1/4".

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Reviews
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Review by Mel Swanson, Verified Purchase on 2022-01-30 

This helpful brush cuts down on cleaning time when you cut with those intricate metal dies.


Review by Natalie Dill, Verified Purchase on 2019-04-08 

Exactly what I needed for my intricate dies. Great little investment!


Review by Crafty Heart, Verified Purchase on 2018-02-14 

So glad to have this useful tool!


Review by tms58, Verified Purchase on 2016-11-19 

This works pretty good but, I was hoping it would be a little easier. Still beats the heck out of pocking & pulling each tiny piece out by hand!


Review by StacyLee, Verified Purchase on 2016-09-01 

This is a MUST HAVE if you use wafer thin dies with lots of detail!




Recommend

Used in Projects
Mini Crop #4   Hello Handsome    

Details

UPC: 841182097989